EOS - Desco Industries

EOS - Desco Industries

ESD Control Experts Electrical Overstress (EOS) and Electrostatic Discharge (ESD) Event 2015 Desco Industries Inc. StaticControl.com Agenda EOS/ESD Basics EOS/ESD Instrumentation Applications EOS/ESD Basics EOS

Fig 2: Transistor failure caused by electrical overstress damage across the die ESD Fig 3: ESD damage/short between Emitter/Collector regions on a device. Electrical Overstress (EOS) EOS Note EOS will be influenced by all signals

EMI ESD Static Field RFI EField RFT Induced Voltage Surge

3M 2014. All Rights Reserved. EMF HField Important Terms EOS: Electrical Overstress Static Field: Electrostatic Field Induced Voltage: Voltage induced into the board or component by contact ESD: Electrostatic Discharge EMI: Electromagnetic Interference EMF: Electromagnetic Field E-Field: Electric Field RFI: Radio Frequency Interference

EFT: Electronics Fast Transients H-Field: Magnetic Field Surge: A sudden, sharp increase of electric current or voltage in a circuit What is Electrical Overstress (EOS)? EOS (Electrical Overstress) is the exposure of a component or PCB board to a current or voltage beyond its maximum ratings. This exposure may or may not result in a

catastrophic failure. Fig 4: EOS on a damaged RS232C transceiver How is Static Generated? - - - + + + + Contact and Separation of

Materials 3M 2014. All Rights Reserved. - - - + + + What is Induced Voltage? Refers to voltage being induced into

the board or component by contact, resulting in current transfer through the component or board. Fig 5: Current flow resulting from Induced Voltage What is Electrostatic Discharge (ESD)? ESD is a rapid, spontaneous transfer of electrostatic charge induced by a high electrostatic field through a spark between

two bodies at different electrostatic potentials as they approach or are separated from one another. There are three different ESD models identified by the standards presently: Charge Device Model (CDM) Machine Model (MM) Human Body Model (HBM) Fig 6: ESD damage to a bi-polar transistor What is Electromagnetic Interference (EMI)? Electromagnetic Interference is a

disturbance that affects an electrical circuit, due to either electromagnetic induction or electromagnetic radiation emitted from an external source. Fig 7: Electromagnetic Interference What is Electromagnetic Field (EMF)? Electromagnetic Field is a physical field produced by electrically charged objects. It affects the

behavior of charged objects in the vicinity of the field. The electromagnetic field extends indefinitely throughout space. Fig 8: Electromagnetic Field from a Cell Phone What is Electric Field (E-Field)? Electric field surrounds electrically charged particles. Electric field exerts a force on other

electrically charged objects. Fig 9: Electric Field from positive and negative charge What is Radio Frequency Interference (RFI)? Radio Frequency Interference (RFI) refers to the noise caused by other Radio Frequency that interferes with information being transmitted. Fig 10: TDMA mobile phone caused false readings in sensor of magnetic head tester and finally caused error message after failing several good GMR

heads What is Electrical Fast Transient (EFT)? An Electrical Fast Transient event is a short-lived burst of energy in a system caused by a sudden change of state. The source of the transient energy may be an internal event or a nearby event. Fig11: Single and bursts of EFT What is a Magnetic Field (H-Field)?

A magnetic field is a field of force produced by moving electric charges. Electric and magnetic fields are two interrelated aspects of a single object, called the electromagnetic field. Fig12: Magnetic Field penetrating a superconductor What is a Power Surge? A Power Surge is an unexpected, temporary,

uncontrolled increase in current or voltage in an electrical circuit. Heavy electrical equipment being cycled on/off is the most common cause of power surge. Fig 13: Power Surge and its effect SCS Products Used for Each Parameter EOS: SCS Iron Man Plus Workstation Monitor Static Field: SCS Air Ionizer Tester/Field Meter and Charger 718 or SCS EM Aware TNG ESD Event Monitor Induced Voltage: (from ground) SCS Ground Pro Ground Integrity Meter, SCS Ground Master, and (by contact) SCS Charge Analyzer/

Charge Monitor 711 ESD: EM Aware TNG ESD Event Monitor, SCS EM Eye Meter, SCS ESD Pro Event Indicator EMI: EM Eye Meter EMF: EM Eye Meter E-Field: EM Eye, ScanEM-C RFI: EM Eye Meter EFT: EM Aware TNG ESD Event Monitor, EM Eye Meter H-Field: ScanEM-C What Constitutes a Safe EOS/ESD Environment? The ultimate goal of an EOS/ESD program is to minimize EOS/ESD exposure to components and its influence on the process. Without closed-loop control, the success of an EOS/ESD program is always uncertain. Most current ESD controls are centered on performance of

individual components of ESD protection, such as grounding, ionizers, materials, etc. If EOS/ESD occurred in your environment, performance of individual protection components is lacking. AN EOS/ESD Program is Only As Strong as its Weakest Link... It Is Imperative to Address All Potential Areas of Damage What Constitutes a Safe EOS/ESD Environment? The Most Ionizers + The Best Ground

+ Everyone Wearing Wrist Straps + Compliance with ESD Standards A Safe EOS/ESD Environment is One Where There is No EOS/ESD Exposure to Sensitive Environments. This Requires a Holistic Approach.

It is Important to Address Each Component of EOS/ESD Control It is Equally Important to Monitor Your EOS/ESD Environment EOS/ESD Instrumentation: Managing Your EOS/ESD Environment by Results Detecting EOS/ESD Events in Your Production Identify and measure EOS and ESD Instrumentation helps ensures compliance Products used: SCS Iron Man Plus Workstation Monitor SCS EM Aware TNG ESD Event Monitor Starter Kit SCS EM Eye Meter

SCS ESD Pro Event Indicator SCS Iron Man Plus Workstation Monitor Monitors: Electrical Overstress on the grounded board Dissipative Ground (bench mat) Operator Resistance and Body Voltage Advantages: Ensures compliance with EOS levels Operator Body Voltage measurement 10^9 Mat resistance

measurement Small and easy to use Set GNDIron Mat U.S. Pat. 6,930,612 SCS EM Aware TNG ESD Event Monitor Monitors: Electrostatic Discharge (ESD) Static Field or Ionization Balance Ionization Decay Advantages:

Measures all parameters through one antenna Rejects non-ESD EMI events LCD display for easy local viewing MODBUS or 4-20mA output to FMS Software available for characterization of ESD Events Small footprint and Joystick for ease of use Used for continuous monitoring of ESD, Static Field and Ionization Decay of production environment

3M EM Aware TNG ESD Event Monitor Starter Kit Diagnostic/Audit Tool: ESD Static Field or Ionization Balance Ionization Decay Advantages: Measures multiple points (up to 6 units) Complete with data acquisition and software for recording

Used as ESD diagnostic tool for different applications Supplies factual data during Diagnostic and ESD Audit ESD Audit: Going by the Facts ESD Audit Report Assumptions

Wrist straps Ground Ionizers Dissipative floors Dissipative garments Static voltage levels Gloves Tweezers Packaging Shelving ESD Audit Report Facts

12 ESD Events stronger than 200V CDM observed at tool # 5 during 8 hrs. shift Maximum strength of ESD Event was 550V CDM ESD Events were correlated with new materials arrival and handling Correction and verification to follow immediately

SCS EM Eye Meter Measuring Instrument: Electrostatic Discharge (ESD) CDM, HBM, MM Electromagnetic Field (EMF) RF Signal Advantages: Portable, light weight, touch screen Open platform use specific sensor for specific parameter. Used as ESD diagnostic instrument Rejects non-ESD EMI events

Supplies factual data during ESD Audit Uses directional antenna or remote antenna Supplied with Calibration Certificate SCS ESD Pro ESD Event Indicator Diagnostic Tool: Electrostatic Discharge (ESD) Advantages: ESD Indicator Displays strength of ESD Event Used as ESD diagnostic tool for different application Supplies factual data during ESD Audit Portable and easy to use Rejects non-ESD EMI events

Identifying Root Causes At the Application Level Finding the Root Causes of EOS/ESD Identify the Application Where EOS/ESD Events are Being Created For Example SMT Line

Soldering Printer Repair Functional Test (Manual or Automatic Testing) Manual Applications Must Know Where to Look 3M Expertise and Technology Can Help EMI influence on EOS Common Mode and Differential mode signals

Powerful Linear Servo-Motors used to move feeders or robotic arms on an Automated tool No filter I=1.562 A Servo Filter I=0.0069A IC Handlers Discharges Happen When:

IC is picked up from the input tray IC is placed in the input shuttle IC is placed in the test socket IC is lifted from the test socket IC is placed in the exit shuttle IC is placed in the output tray Pick and Place Discharges Happen When: IC is picked up from the tape and reel IC is picked up from the tray IC is placed on the board

Mechanism of EOS/ESD Damage in Handlers or Pick & Place Io n iz e r This Scenario Covers the Discharge Resulting from the Tribocharging of Encapsulation of the IC Io n iz e r a tte m p ts to d is s ip a te c h a rg e o n th e IC

IC is b e in g m oved T r ib o c h a r g e is c r e a te d o n th e IC w h e n IC is lifte d IC r e ta in s s ig n ific a n t c h a rg e D is c h a r g e w h e n IC to u c h e s th e s u rfa c e Soldering and Soldering Extract CDM or CBE Discharges Happen When: Board travels and touches a grounded

soldering wave Soldering tip touches the component or the board Solder touches the board Component separation from board during extract application Data Received from Wire Bonding Wire Bonder ESD pattern with the same spacing during production. Dual ESD Event other then Wire Bonder pattern during

production. Data Received from Multitester ESD Events Detected At: Multitest #6 Dispenser Multitest #6 Q-Test The lowest ESD Event detected on channel 1 was 38V CDM and the highest ESD Event detected on channel 1 was >500VCDM The lowest ESD Event detected on channel 3 was 19V CDM and the

highest ESD Event detected on channel 3 was 240VCDM Static Voltage is higher at the Q-Test area When operator is not testing the chips no ESD Events are detected in the area Static Voltage at the dispenser area is normally low with the exception when parts are put in the dispenser Safe EOS/ESD Environment Based on Results

All EOS/ESD Protective Measures are Designed to Prevent EOS/ESD Events By Managing EOS/ESD by Protective Measures, You ASSUME that Your EOS/ESD Problems are Solved By Monitoring Your Environment and Managing EOS/ESD by End Results, You KNOW that EOS/ESD Problems are Solved SCS Products & Services: Putting it All Together Products Instrumentation for monitoring and detection of ESD/EOS events Workstation Products for prevention of ESD/EOS events during mfg Bags for prevention of ESD/EOS events during transit

Services Step 1: Audit/Assessment of facilities by certified SCS ESD/EOS expert Step 2: Detailed in-person training for your ESD managers and coordinators Step 3: High-level training for operators and managers Step 4: Continuous monitoring and support by SCS ESD/EOS experts SCS is Not Just a Supplier, but a Collaborator And Your Competitive Advantage

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