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April 22, 2002 Towards Standards-based Engineering Frameworks in the Electronics Domain Russell Peak Senior Researcher Manufacturing Research Center Georgia Tech Plus other contributors as noted Contents Motivation Intro to ISO 10303-210 (STEP AP210) Example Organizations and Their Activities Example Applications & Vendor Tools Hands-On Exercises Usage in the Product Development Process

Summary & Recommended Approach 2 Motivation: Product Challenges Trend towards complex multi-disciplinary systems Demanding End User Applications MEMS devices http://www.zuken.com/solutions_board.asp 3D interconnects Source: www.ansys.com 3 Motivation: Engineering Tool Challenges 2001 International Technology Roadmap for Semiconductors (ITRS) http://public.itrs.net/Files/2001ITRS/Home.htm Design Sharing and Reuse Tool interoperability Standard IC information model Integration of multi-vendor and internal design

technology Reduction of integration cost Simulation module integration Seamless integration of simulation modules Interplay of modules to enhance design effectiveness 4 Advances Needed in Engineering Frameworks 2001 International Technology Roadmap for Semiconductors (ITRS) http://public.itrs.net/Files/2001ITRS/Home.htm 5 Analogy Physical Integration Modules Model Integration Frameworks Design System Architecture Stacked Fine-Pitch BGA www.shinko.co.jp System-On-a-Package (SOP) Wafer Level Packaging

RF, Digital, Analog, Optical, MEMS www.prc.gatech.edu 2001 ITRS Multidisciplinary challenges require innovative solution approaches 6 Interoperability Seamless communication between people, their models, and their tools. Requires techniques beyond traditional engineering Information models Abstract data types Object-oriented languages (UML, STEP Express, ) Knowledge representation Constraint graphs, rules, Web/Internet computing Middleware, agents, mobility, Emerging field: engineering information methods Analogous to CAD and FEA methods 7 Contents

Motivation Introduction to ISO 10303-210 (STEP AP210) Example Organizations and Their Activities Example Applications & Vendor Tools Hands-On Exercises Usage in the Product Development Process Summary & Recommended Approach 8 Intro to ISO 10303-210 (STEP AP210) Business driver example See separate file

Rockwell Collins - Jack Harris (2001 AFEI Expo) Content of AP210 Tom Thurman, et al. Status and example implementations PDES Inc. Electromechanical Pilot Update - Greg Smith Vendor examples LKSoft - Lothar Klein See separate file STEP-Book AP210 Usage Overview with Hands-on Exercises - Russell Peak See separate file 9 R STEP AP 210 (ISO 10303-210) Domain: Electronics Design ~800 standardized concepts (many applicable to other domains) Development investment: O(100 man-years) over ~10 years Configuration Controlled Design of Electronic Assemblies, their Interconnection and Packaging

Interconnect Assembly Printed Circuit Assemblies (PCAs/PWAs) Product Enclosure Die/Chip Packaged Part Printed Circuit Substrate (PCBs/PWBs) Die/Chip Adapted from 2002-04 - Tom Thurman, Rockwell-Collins Package External Interfaces 10 R

STEP AP210 Scope Scope is As-Required & As-Designed Product Information Design In Process & Release Design views (white boxes) & usage views (black boxes) Design at individual or multiple levels: microsystems, packages, PCAs, units, Sharing Partners: Engineering Domains Design / Analysis Manufacturing / Analysis Sharing Across Several Levels of Supply Base 11 R STEP AP210 Models Requirements Models Design

Constraints Interface Allocation Functional Models Functional Unit Interface Declaration Network Listing Simulation Models Signals Component / Part Models Analysis Support Package Material Product Properties White Box/ Black Box Pin Mapping Assembly Models Interconnect Models User View Design View Component Placement Material product Complex Assemblies with Multiple Interconnect

GD & T Model Datum Reference Frame Tolerances Configuration Mgmt Identification Authority Effectivity Control Net Change User View Design View Bare Board Design Layout templates Layers

planar non-planar conductive non-conductive Rich Features in AP210: PWB traces AP210 STEP-Book Viewer - www.lksoft.com 13 Rich Features in AP210: Via/Plated Through Hole Z-dimension details 14 Rich Features in AP210: Electrical Component The 3D shape is generated from these smart features which have electrical functional knowledge. Thus, the AP210-based model is much richer than a typical 3D MCAD package model. 210 can also support the detailed design of a package itself (its insides, including electrical functions and physical behaviors). 15 Rich Features in AP210: 3D PCB Assembly

AP210 STEP-Book Viewer - www.lksoft.com 16 Another AP210 Viewer Boeing/PDES Inc. 2002-03 - Mike Keenan, Boeing 17 Intro to ISO 10303-210 (STEP AP210) Business driver example See separate file Rockwell Collins - Jack Harris (2001 AFEI Expo) Content of AP210 Tom Thurman, et al. Status and example implementations PDES Inc. Electromechanical Pilot Update - Greg Smith

Vendor examples LKSoft - Lothar Klein See separate file STEP-Book AP210 Usage Overview with Hands-on Exercises - Russell Peak See separate file 18 Selected STEP for Electronics Activities STEP Electro-Mechanical Activities Standards Development and Deployment AP210, AP220, AP233 Advocacy Implementation Marketing Education 2002-03 - Adapted from Greg Smith, Boeing Company Activities Producibility Analysis (DFM)

(B) IDF/AP210 Conversion (R/B/ N) STEP Repository (GT/N/B) Mentor AP210 Translation (B/N/L/AT) Manufacturing Simulation (R) AP203/AP210 Conversion (N, T) AP210 Viewers (B, STI) Zuken AP210 Translation (R/L/ AT) AP210 Book (L) PWA/PWB Stackup (GT/N) Eagle AP210 Translator (L)

AP210 Primer (A) Analysis Templates (GT) Related Activities AP212 Wiring Harnesses, etc. www.ecad-if.de Company Legend B Boeing N NASA GT Georgia Tech A U.S.Army R Rockwell-Collins GM General Motors L LK Software T - Theorem Solutions AT - ATI/PDES Inc. STI - STEP Tools Inc. 19 PDES, Inc. Electro-Mechanical Pilot

Primary Participants ATI, Boeing, Georgia Tech, LKSoft, NASA (JPL and Goddard), Rockwell-Collins, U.S.Army Support the implementation of STEP for Electronics within the US and the world. Series of activities worked by individual companies and teams of companies. Activities include: Interface/Translator development and marketing Standards publicity Tool development Standard development/refinement (AP210, AP220, AP233) Test cases, recommended practices 20

PWA/PWB Assembly Simulation using AP210 User Alerted on Exceptions to Producibility Guidelines Rules (From Definition Facility) Generic Manufacturi ng Equipment Definitions 2002-03 - Tom Thurman, Rockwell-Collins Specific Manufacturi ng Equipment Used 21 PWA/PWB Producibility Analysis using AP210

Codification of Guidelines (Rules Definition) Company PWA/PWB Guideline s Manufacturi ng Capabilities STEP AP220 Rules STEP AP21 0 PWA/PWB Captured in Mentor Design Tools 2002-03 - Greg Smith, Boeing Comparison of Rules Against Product Data (Rules Execution)

Producibili ty Analysis Report 22 PWA/PWB Producibility Analysis using AP210 Producibility Analysis Report Boeing PWA Analysis Completed - Generating Summary, Please Stand By... During this Analysis: 14 Administration Checks were Executed. 40 Data Collection Checks were Executed. 52 Analysis Checks were Executed. ----------------------------------------------------------------------106 Checks Total were Executed. The Analysis on PWA: B169-78762-4, resulted in the possible violation of 5 rule(s) and 5 guideline(s). The following (5) rules may have been violated by this design: IPG Sec 3.3.4 Check PWA support for Surface Mount Automation (Check175 Ver248.25) IPG Sec 3.3.2 Check PWA Requirement for In-Circuit Test (Check176 Ver241.29) IPG Sec 3.2.9 Check Minimum PWB Dimensions for Wave Solder equipment (length)

(Check17 Ver16.3) IPG Sec 3.5.5 Check Surface Mount Device Test Keep Out Zone - Minimum Edge (Components) (Check185 Ver296.12) IPG Sec 3.5.3 Check Wave Solder & Vibration Test Keep Out Zone - Minimum Edge (Components) (Check184 Ver531.9) The following (5) guidelines may have been violated by this design: IPG Sec 3.10 Check PWA support for Mixed Technology (Check58 Ver310.28) IPG Sec 3.6.2 Check Common Surface Mount Component Orientation (Modulo 180) (primary) (Check34 Ver35.2) IPG Sec 3.10.5 Check Radial Component Lead Span (Check157 Ver914.57) IPG Sec 3.2.1 Check Maximum PWB Thickness (Check14 Ver245.8) IPG Sec 3.10 Check PWA support for Mixed Technology (2) (Check70 Ver255.26) ***** Analysis 2002-03 - Greg Smith, Boeing Completed on 02/27/2002 at 8:20:03AM 23

Product Model-Driven Analysis Iterative PWB Stackup Design & Warpage Analysis Analysis Template Methodology http://eislab.gatech.edu/projects/ PWB Stackup Design Tool 1D Thermal Bending Model Quick Formula-based Check b L2 T t Layup Re-design b w y t / 2 w i i i

i AP210 Analyzable Product Model 2D Plane Strain Model Detailed FEA Check 1 Oz. Cu 3 x 1080 Tetra GF 2 Oz. Cu 1 Oz. Cu Tetra GF 1 Oz. Cu 2 Oz. Cu 2 x 2116 3 x 1080 PWB Warpage Modules

1 Oz. Cu 24 Intro to ISO 10303-210 (STEP AP210) Business driver example See separate file Rockwell Collins - Jack Harris (2001 AFEI Expo) Content of AP210 Tom Thurman, et al. Status and example implementations PDES Inc. Electromechanical Pilot Update - Greg Smith Vendor examples LKSoft - Lothar Klein See separate file STEP-Book AP210 Usage Overview with Hands-on Exercises - Russell Peak See separate file

25 Contents Motivation Introduction to ISO 10303-210 (STEP AP210) Example Organizations and Their Activities Example Applications & Vendor Tools Hands-On Exercises Usage in the Product Development Process Summary & Recommended Approach 26 AP210 Usage Supply Chain System Engineer

Package Data Supplier Simulation Model Supplier Requirements Design Team ECAD Configuration Managed Corporate Data Process (PDM/Library) Customer MCAD Device Supplier 2002-03 - Tom Thurman, Rockwell-Collins Assembly & Fabrication Vendor(s) 27 AP210 Usage

Multidisciplinary Engineering Interaction System Engineer EE Vendor Web Site Initial Task Negotiation and data dump to EE Sys Eng Gets More Data 2002-03 - Tom Thurman, Rockwell-Collins Sys Eng sends data to EE EE Performs Task EE Transmits Data to Sys Eng

Final Data Package Stored in Repository 28 Electro-Mechanical Design Flow Vision System Engineering Electrical Iterate Iterate Manufacturing STEP Data for Exchange AP 233 AP 210 Mechanical 2002-03 - Tom Thurman, Rockwell-Collins

Iterate PWI 220 Iterate Manufacturing Circuit Board Assembly Quality Product Multi-Card Module 29 Multidisciplinary Design Issues Typical Resulting Errors Today

Connector off by 2 mm Signal off by 1 pin Design change caused electromagnetic problem Manufacturing change caused interference problem Thermal source moved causing drift problem Physical pin name doesnt match simulation model port name Adapted from 2002-04 - Tom Thurman, Rockwell-Collins Problems: Error-prone manually maintained associativity (and/or gaps) between disciplinary models! 30 Multidisciplinary Design Issues Typical Process Gaps Today Engineering Properties Data Sources for Material Queries Exist Internet/Intranet Query/Response Capability May or May not be Accurate May need Interpretation

On-line Engineering ECAD/MCAD Models to Support Synthesis are Needed but on-line Detailed Packaging Definitions are dumb images (e.g. pdf files or low-level CAD models) Adapted from 2002-04 - Tom Thurman, Rockwell-Collins Problem: Semantically poor upstream models 31 Multidisciplinary Design Needs Design Requires: system, s/w, electrical, mechanical, manufacturing, logistics, analysis Synthesis-Based Design Synthesis Relates a Construct Extracted from a Discipline Specific Library to a Design Structure and Establishes Intentional Connections Between the Constructs in that Structure Analysis Evaluate (Discipline Specific) Design Structure for

Compliance with Requirements Adapted from 2002-04 - Tom Thurman, Rockwell-Collins 32 Multidisciplinary Design Needs (cont.) Discipline Library Validated Only Within the Context of that Discipline May Include Multiple Product Definitions that are Related at Detailed Level May be Obtained From Another Organization May need Interpretation Discipline Product Definition The Synthesis Result Tied to a Product Version in PDM with one Relationship -- Discipline View Adapted from 2002-04 - Tom Thurman, Rockwell-Collins 33 AP 210 Approach to Enable Multidisciplinary Design

Focus on Interfaces! (associativity between models) Formal Mapping Technology Based on Explicit Instance Relationships (I.e., not based on names) Relationships may be simple or based on algorithm Relationships allow Data Verification Use Generic External Mechanism for purely Behavioral Property Data (I.e., resistance, rise time) Maintain Key Relationships and Data Provide a Standard Way to Describe Structural Relationships Connecting Discipline Views Relationships are Implemented in Library Adapted from 2002-04 - Tom Thurman, Rockwell-Collins 34 AP210-based Multidisciplinary Model Associativity Ex. Application: Requirements & Functions Allocation Traceability Requirements Functions (Design Intent) Parts

Assemblies Requirements Decomposition Functional Decomposition (Network) Physical Unit Network Physical Assembly Decomposition Each column is a typical stovepipe (a CAx tool island of automation) Requirement To Function Requirement To Assembly

Requirement occurrence Requirement Verification Model Functional Path Subset (Single Node) Design Library Function Definition Omitted for Clarity: 1. Details of recursive definition 2. Pin Mapping in library 3. Simulation model library and associativity aspects. Function to Physical

Map Physical Interconnect Decomposition Requirement To Interconnect Functional Path Subset To Assembly Function Occurrence Assembly Backbones (e.g., PCB) Physical Occurrence Physical Unit Network Subset (Single Node) Assembly to Interconnect

Function to Layout Each yellow bubble is a typical associativity gap (problem area) Layout Occurrence Physical Macro & Component Definition Simulation Model Definition Layout Network Subset to Implement Node Layout Macro &Template Definition Adapted from 2002-03 - Tom Thurman, Rockwell-Collins

35 Contents Motivation Introduction to ISO 10303-210 (STEP AP210) Example Organizations and Their Activities Example Applications & Vendor Tools Hands-On Exercises Usage in the Product Development Process Summary & Recommended Approach 36 Status 2002-04

AP210 standard release 1 done Much ready for deployment Interfaces to other vendor ECAD tools underway Following EAGLE example - see www.ap210.org Need more international involvement Build momentum for widespread 210 usage Collaboration among intra-company groups Collaboration among external partners Format for rich standards-based component info 37 Analogy Physical Integration Modules Model Integration Frameworks Design System Architecture Stacked Fine-Pitch BGA www.shinko.co.jp System-On-a-Package (SOP) Wafer Level Packaging

RF, Digital, Analog, Optical, MEMS www.prc.gatech.edu Challenge: Integrating Diverse Technologies 2001 ITRS 38 Recommended Approach Philosophy: Consider engineering design environments as analogous to physical systems like electronic packaging A system composed of components (software tools, hardware, methods, standards, ) Leverage international collaboration with other industries Contribute personnel and/or funding Develop standards, test cases and scenarios Perform collaborative pilots to test, improve, and learn

Learn by doing and interacting with others Example: Join PDES Inc. and/or sponsor projects 39 Recommended Approach (cont.) Follow systems engineering approach Decompose problem into subsystems Architectures, components, techniques, Identify & define gaps Identify existing solutions where feasible Define solution paths Identify who will supply/develop these components Develop & prototype solutions Advocate solution standardization and vendor support Test in pilots Deploy in production usage 40 Where to Get More Information www.ap210.org

ap210.aticorp.org step.nasa.gov www.tc184-sc4.org www.ecad-if.de 41

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